MPi Advanced Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer tests for Show driver, logic, and memory system. MPI’s cantilever probes will be the corresponding respond to for the calls for of fi­ne pitch, smaller pad measurement, higher pace, less cleaning, multi-DUT, higher pin count, and ultra-minimal leakage necessities. With superb craftsmanship, revolutionary architecture and verified methodologies determined by mechanical and electrical simulation/measurement effects, earning MPI the best cantilever service provider worldwide.


FCB Probe Card

The FCB Probe Card is the most experienced technological know-how of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) desire. FCB is often a established Resolution for various semiconductor creation exams from early engineering pilot-runs to superior quantity manufacturing (HVM). FCB is ready for machine demanding substantial signal integrity probing (SI) and/or power integrity probing (PI). Purposes incorporate reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB assures the earth’s ideal General Price tag-of-possession (COO) for different DUT applications.


EVS Probe Card

The EVS Probe Card is really an enhancement over the traditional buckling beam probe card. Crucial features are increased present carrying potential (C.C.C.) and decrease balanced Get hold of force (BCF), and All round MEMS-like characteristics. EVS can certainly fulfill the necessity of advanced wafer probing. Exact alignment and fantastic planarity Handle are the critical factors contributing to steady contact resistance. With its capability and performance, EVS Probe Card is a great option for Sophisticated probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Alternative to need for ever finer pitch. It can be made for scaled-down Al pad, and is ideal for little pitch software with peripheral and full array pattern. With exact alignment and superior planarity control, Osprey can achieve better efficiency by multi-DUT design and style.  The forming wire (FW) form needle produced with MPI’s personal micro fabrication method not merely provides higher-good quality effectiveness but will also allows simple needle substitute and shortens preserving cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle which can be made for the need of minimal power probing. What's more, it includes the opportunity to satisfy large C.C.C. and large pin counts application. more info The MEMS process makes sure really reliable needle features, plus the Specific construction style enables specific alignment and planarity Management.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/
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MPi Advanced Probe Cards”

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